Qualcomm And BRUSA Sign A WEVC Patent License Agreement

Looking forward to the huge potential that a user-friendly wireless charger offers in automobile industry, Qualcomm and BRUSA have entered into a Wireless Electric...

Raspberry Pi Imparting Free Embedded Design To Teachers

One of the key activities of Raspberry Pi Foundation is imparting knowledge to students of all ages in embedded design. Its programme of training...

Mikroprojekt Utilises Microsemi Platform For Development Of HMI Kit

Microsemi collaborates with Mikroprojekt that uses SmartFusion2 SoC FPGAs platform to develop a fully deployable human machine interface (HMI) kit. The media release mentions...

Infineon Reaches Milestone Of Ten Millionth Radar Chip For Cars

Infineon reaches a new milestone of shipping ten millionth high-frequency radar chip for cars. The new landmark achieved by Infineon makes them the global...

BiCMOS Technology For Next-Generation Mobile Networks

The next-generation mobile networks will be able to deliver developing energy-efficient, high-capacity transmission systems with new BiCMOS55 SiGe technology from ST. ST's BiCMOS technology...

New Memory That Is 1000X Faster Than NAND And 10X Denser Than Conventional Memory

Micron, in association with Intel has unveiled the new 3D XPoint technology which is up to 1000 times faster and has up to 1000...

Blu Wireless Joins 5GIC for Next-Gen Mobile Communication

Blu Wireless Technology Ltd has joined the University of Surrey’s 5G Innovation Centre (5GIC), the research center dedicated for the development of next generation...

ROHM And Powervation JV To Provide Next-Generation High Performance Power Solutions

In a recent strategic move, ROHM has accquired a digital power IC company called Powervation Ltd that develops digital power management system-on-chip (SoC) solutions....

ARM Acknowledges FD-SOI Technology For The Mobile SoC Market

Considering fully depleted silicon on insulator (FD-SOI) as an interesting technology for the mobile SoC market, ARM EVP Pete Hutton in an interview commented, “If...

Sensor Expo California: Printed Polymer Sensors The Next Big Change In IoT Technology

According to a press release, Hoffmann+Krippner demonstrated how sensors based on printed polymer pastes can be accurate enough for IoT position or pressure sensors...

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