Congatec Presents Cooling Solutions for High Power Edge Servers

  • Built around AMD EPYCTM Embedded 3000 series processors
  • Efficient waste heat management systems

Perfectly matched cooling systems are essential for high-power edge server ecosystem, as overheating can lead to rapid performance degradation and system failure. Edge servers with real-time operability need optimum protection to ensure proper deterministic behaviour, which further highlights the importance of high-performing cooling systems for industrial computing systems.

Congatec, a manufacturer of standardised and customised embedded computer boards and modules, presents rugged cooling solutions for the new 100W edge server ecosystem built around AMD EPYCTM Embedded 3000 Series Processors.

The congatec cooling solutions for the 100W ecosystem around the AMD EPYC Embedded 3000 Series Processors come in three variants, all based on the COM Express heatspreader specification that has been standardised by the PICMG, i.e. heatspreader with heatpipe adapter, heatspreader with integrated heatpipe and an active cooling solution.

Powerful heatpipe adapter


The conga-B7E3/HPA heatpipe adapter absorbs the waste heat from the heatspreader through up to four heatpipes and directs it towards other passive heat sinks. This allows the design of extremely powerful passively cooled systems.

Heatspreader with integrated heatpipe

The conga-B7E3/HSP-HP solution with integrated heatpipe, built especially for flat embedded systems, distributes the waste heat from the processor evenly over the entire heatspreader so that no hotspots are created, even in applications with a Thermal Design Power (TDP) of up to 100 Watt.

Cooling for 24/7 operation

The fan-based active cooling system for COM Express Computer-on-Modules, the conga-B7E3/CSA-HP, has been specifically designed for 24/7 operation in harsh industrial environments. In this, the fans are securely mounted for reduced wear and tear.

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In addition, the bearings are equipped with a special seal and additional cover to provide maximum protection to the mechanics and lubricant. This ensures that the fan has a Mean Time Between Failures (MTBF) of several decades and an industrial-grade shock and vibration resistance in a temperature range from -45 degrees Celsius to +85 degrees Celsius.

Additional integration of a heatpipe to this cooling system distributes the waste heat from the processor even before it reaches the active fan.

“The AMD EPYC Embedded 3000 Series Processors provide a new level of high-performance computing for embedded edge server systems. But with such embedded system designs, it is critical to managing the thermal envelope of any high-performance part. That’s why we’ve worked hard to create a 100 Watt ecosystem for high-performance COM Express modules that meets the rugged design requirements for 24/7 operation.” explains Andreas Bergbauer, Product Line Manager at congatec.

“The AMD EPYC Embedded 3000 Series Processors allow for a wide range of embedded edge server designs. It is great to see that companies such as congatec invest in offering a complete ecosystem with Server-on-Modules and all required accessories, such as these powerful cooling solutions, which will help simplify designs and help end customers get systems faster,” explains Stephen Turnbull, director of product management and business development, Embedded Solutions, AMD.

Now, OEMs will no longer need to think about how to design a waste heat management system. Together with standard COM Express heatspreaders, they can now choose between four variants that cover the entire range of processor cooling solutions.



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