Congatec Provides Compute Power Loss-Free To The Industrial Fields

  • Offers advanced cooling performance
  • Low power consumption

Congatec, the high-performance embedded computing product supplier announces the release of the new conga-JC370 3.5-inch SBC with 8th generation Intel Core processors. The product has received excellent design ratings in independent studies and phenomenal positions in UserBenchmark speed tests.

Featuring Intel Core i5-8365UE, 4 of GB RAM (can be extended to 64 GB) and running Windows 10 Pro, the new Congatec 3.5-inch single-board computer (SBC) includes much less power-hungry processors than its competitors.

This confirms that the better overall score derives from excellent implementation, including all components such as chipset and external controllers.


“Everyone knows, even the greatest performance improvements of a processor can get lost if the final board design cannot render the compute power loss-free to the various industrial fields. So we are very proud that our new conga-JC370 3.5-inch SBCs proved their outstanding computing performance in these tests. Plus, the test results underline that Congatec knows how to design best-in-class boards,” says Martin Danzer, Director Product Management at Congatec.

Good power and thermal features

The test further shows that the CPU also does very well with its TDP of 15 W when power consumption is taken into account. Consequently, the conga-JC370 was found to offer an extremely good power-per-watt ratio, as well as, excellent thermal behaviour. When running a stress test on the SBC for almost an hour with an overall CPU utilization of 98.7 per cent, no throttling was required for cooling down the CPU. This is important for all applications that depend on getting full performance at all times. Still, the overall power consumption remained below 15 W and the average temperature was as low as 39.2 degrees Celsius, with a maximum of only 61 degrees Celsius.

Onboard MIPI Camera Support For Quick Solution Implementation

One reason for these exceptional results, besides the processor’s microarchitecture, is the advanced and tailored cooling that for the conga-JC370 3.5-inch SBC. Cooling solutions for the new 3.5-inch SBC include a heat spreader, a passive design without moving parts for rugged applications as well as an active cooler for high-performance use cases. Application-ready cooling solutions are a huge benefit for all OEMs looking for an easy-to-use, application-ready platform off-the-shelf.



Please enter your comment!
Please enter your name here

Are you human? *