- TI offers high efficiency and low thermal resistance for industrial applications with a new power module in a QFN package
- This new power module comes with a single thermal pad that optimises heat transfer
Texas Instruments (TI) introduced a new power module in a quad flat no-lead (QFN) package. The module can operate at 36V with a current output of up to 4A. According to the company, the TPSM53604 DC/DC buck module has a footprint of 5-mm-by-5.5-mm. It enables the design engineer to shrink the size of their power supply by 30 per cent. Additionally, it reduces the power loss by 50 per cent when compared to similar competing modules.
This new power module comes with a single thermal pad. It optimises heat transfer. This enables simplification inboard mounting and layout.
The TPSM53604 can operate in ambient temperatures up to 105°C. With this feature, it can support rugged applications in factory automation and control, grid infrastructure, test and measurement, industrial transport, and aerospace and defence applications.
Engineers can create a complete power solution using the TPSM53604 with a compact step-down module. The design can create a buck converter from a 24-V input down to the point of load, minimizing the design time and efforts.
Shrink and simplify the power solution
The device is designed under a total area of 85 mm2 for a single-sided layout. The company claims that this package is the smallest solution for common 24-V, 4-A industrial applications. The standard QFN footprint can help in simplifying the embedded design. Hence, it reduces time to market.
Efficiently dissipate heat at high ambient temperatures
42 per cent of the TPSM53604’s QFN package footprint touches the board. This enables more efficient heat transfer compared to the present solution( ball-grid-array (BGA) packages).
In addition, this module has an in-built buck converter. It integrates MOSFETs with low drain-source on-resistance (RDS(on)). This provides a conversion efficiency of up to 90 per cent while operating at 24 V.
Easily meet EMI standards
The TPSM53604’s is integrated with high-frequency bypass capacitors. It also minimises the use of bond wires. This helps an engineer to meet the electromagnetic interference (EMI) standard defined by CISPR (Comité International Spécial des Perturbations Radioélectriques ) 11 Class B limits.
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