- Allegro MicroSystems has announced the release of custom SOIC16W package
- The package is built with a SOIC16W footprint that increases the use of this package in smaller PCBs
With a trend toward smaller solution size, engineers face more thermal challenges. Allegro MicroSystems has announced the release of custom SOIC16W package. According to the company, the “MC” package marks a leap forward in the industry’s current sensing capabilities for power dense applications. The module targets application that requires high isolation with low power loss.
Provides improved current density
The new MC package has a copper lead frame. This frame is more than two times (2X) thicker than that of standard SoIC semiconductor packages. It features an improved current density while decreasing the resistance. It also improves the overall power density in customer applications.
Built-in SOIC16W footprint
The package is built with a SOIC16W footprint. This increases the use of this package in smaller PCBs. According to the company, the package is capable of handling a continuous current of up to 80 A. The rated current also depends on the operating temperature requirements and as a result, reduces the need for external cooling components.
Isolation rated for up to 5kV
This new package has a low series resistance of up to 265 micro-Ohm. This value of resistance is up to 2.5 times lower than existing SOIC16W solutions. It decreases the resistance while delivering Allegro’s highest certified isolation rating of 5kV.
A wide number of applications
The first devices available in this new package are Allegro’s current sensor ICs ACS724 and ACS725. These IC’s can offer optimum performance in terms of speed and accuracy. They are suitable for applications like DC/DC converters, solar inverters, UPS systems, xEV On-Board Chargers (OBC), EV charging pile, and motor control.
Shaun Milano, Business Unit Director for Current Sensors at Allegro, recently explained,
“ We all need to work toward a more sustainable future and Allegro’s innovations are leading the way. Designers of electric and hybrid vehicles are working to reduce the weight and size of their systems. They need to deliver higher power density solutions, and the new MC package now makes this easier than ever. ”