Congatec’s Embedded Edge Computing Solutions For Edge Servers

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These include a wide variety of products – from MIPI camera technology, real-time RFP kit to AI development kit and smart cooling solutions

At the upcoming Embedded World 2020, Congatec, a developer of embedded computing products, will be showcasing numerous technological solutions, one of which is the PICMG COM-HPC standard, which is currently deployed for real-time workloads.

“The innovations around COM-HPC are extremely significant as they establish a new standard for edge servers and extend the success of COM Express into new application areas. This is why they take centre stage in our presentation,” explains Martin Danzer, Director of Product Management at Congatec. “What is also crucial is the fact that Congatec covers the entire range of embedded edge logic, from high-end edge servers to deeply embedded ultra-low-power edge logic-based on ARM processors. We provide comprehensive OEM Hardware and Firmware support across all these platforms, ensuring optimum connectivity, highest security and most convenient remote maintenance together with vision and AI integration, which is becoming increasingly important in many edge devices. With these hardware-centric additional services, we offer our customers much more than simple interface support. We provide them with highly customized solution platforms for the easiest possible integration of their embedded edge computers.”

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The COM-HPC presentations will focus on the variety of its available embedded edge servers and embedded clients. The edge server variants come in two footprints that offer up to 64 PCIe lanes, 8x 25 GbE and 8 DIMM sockets for 1 TB of RAM.

The smaller COM-HPC client modules are available in three different footprints, which have four video interfaces, two camera inputs and offer up to 4 SODIMM sockets.

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SMARC ecosystem

With respect to Congatec’s extended SMARC ecosystem for the NXP i.MX8 family, which is designed for the seamless use of MIPI camera technology and artificial intelligence, the company will be highlighting innovative AI and WiFi solutions. They have all been designed for easy integration of the i.MX 8X, i.MX 8M Mini and i.MX8  processors.

For an immediate, off-the-shelf design, Congatec also provides individually compiled binaries via Git-Hub that allow developers to boot their platforms directly.

RFP Ready Kit

Congatec, in collaboration with Intel and Real-Time Systems, has developed an Intel RFP Ready Kit for real-time workload processes. The RFP Ready Kit utilises the RTS Hypervisor (from Real-Time Systems) on Congatec’s COM Express Type 6-based Intel Xeon E2 industrial application server platform.

This will enable OEMs and electronics designers to directly start the development of next-generation vision-based collaborative robotics, automation controls and autonomous vehicles for simultaneously tackling multiple tasks such as situational awareness utilising deep learning-based AI algorithms.

AI development kit

An AI Development Kit that is based on highly scalable and powerful Congatec Qseven modules with Intel ‘Apollo Lake’ processors, allows developers to directly evaluate the advantages of sparse modelling-based AI to perform AI training tasks on the edge in addition to inference algorithms.

Smart Camera kit

The MIPI-CSI 2 Smart Camera Kit for vision systems at the edge integrates all hardware and software components that are needed for the development of embedded vision-based applications. For example, the SMARC carrier board features flat-foil connectors for the direct connection of Basler’s MIPI cameras.

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Cooling solutions

Finally, innovative cooling solutions for high-performing and robust edge servers, are needed to allow users to take advantage of the full performance of the 16-core COM Express Type 7 modules with 3 GHz dual-die AMD EPYC Embedded 3000 processors.

With such a wide range of low-power to high-end modules and development kits, all user groups are set to benefit.

Congatec will be showcasing these at the Embedded World 2020 to be held from 25 – 27 February 2020 in Germany.


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