- Toray Industries have created a new polyphenylene sulfide (PPS) film that maintains the outstanding dielectric characteristics of the material
- According to the company, they were able to maintain the properties of PPS polymer with an increased thermal resistance of up to 250°C
- The major areas of implementation will be the smartphone and wearable industry
5G is commanding attention as an advanced platform for delivering outstanding speed capacity, multi-connectivity, and low latency. It harnesses frequency bands below six GHz and above 20 GHz.
Liquid crystal polymer (LCP) films are currently used in designing a flexible printed circuit substrate material needed for 5G applications. The other type of material for fabricating the film is PPS. Generally, PPS film offers superior flame retardancy and chemical resistance. It exceeds the dielectric properties of LCP films.
PPS films deform easily under high temperatures
It also features increased resistivity against extreme temperature and humidity. On the downside, PPS film deforms easily at high temperatures and provides insufficient resistance to heat when soldering circuit boards.
Toray Industries has created a new polyphenylene sulfide (PPS) film that maintains the dielectric characteristics of the material. PPS is a super engineering plastic that offers high electrical insulation. It forms a crystalline package structure. The melting point of PPS is up to 280°C.
PPS shows deform resistance up to 250°C
It offers low dielectric losses of electrical energy and flame retardancy. The chemical robustness of the polymer is increased to withstand thermal runaway of up to 40°C higher than conventional PCB materials.
According to the company, they were able to maintain the properties of PPS polymer with increased thermal resistance. The test result shows no deformity on the PPS film for a temperature of up to 250°C. These results conclude that the new film can resist deformation and is dimensionally stable near its melting point.
Two key benefits to 5G devices
The use of these new films in flexible printed circuits can provide two primary benefits to 5G devices. First, the film can cut the transmission losses of communication devices at high frequencies. Secondly, it can help in establishing stable high-speed communication across the temperature and humidity spectrums. Flexible printed circuits are formed using soft insulating base films with copper foil or other conductive metals.
Toray also informed that they have completed a prototype board using the technology. The company is looking to have a mass production setup in place during fiscal 2020. It can provide a marketing platform to the company.
Offers thermal resistance while PCB soldering
The dielectric properties of such films can reduce transmission losses in high-frequency bands. These films also offer thermal resistance when soldering circuit boards. Toray is also claimed to attain a coefficient of thermal expansion in the thickness direction of up to 98 ppm per degree Celcius. It uses employing technology to control the orientation of film molecular chains.
The company already has a product TORELINA, available in market. It is a biaxial-oriented PPS film. Toray looks to secure the adoption of its new film in the FPC market. The targeted areas of application are smartphones, automotive and industrial applications.