The chip’s efficient computing power bolsters AI functionalities ranging from speech recognition to deep learning
Baidu, the leading Chinese language internet search provider, in collaboration with Samsung Electronics, has developed its first cloud-to-edge AI chip, known as the Baidu KUNLUN. This AI chip is set to begin mass-production from next year.
High density in less space
Built on Baidu’s advanced neural processor architecture for cloud, edge and AI, along with Samsung’s I-CubeTM (Interposer-Cube) solution, the AI chip offers 512 gigabytes per second (GBps) memory bandwidth and can do 260 Tera operations per second (TOPS) at 150 watts. Samsung’s I-CubeTM technology connects a logic chip and high bandwidth memory (HBM) 2 with an interposer for providing a high density/ bandwidth in less space.
It is expected that I-CubeTM technology will create a landmark in the computing market and thus improve signal performances by more than 50 percent.
Wide support for AI-based functions
With the help of the AI chip’s efficient computing power, Baidu is supporting a wide variety of AI-based functions such as search ranking, speech recognition, image processing, natural language processing and deep learning.
“We are excited to lead the HPC industry together with Samsung Foundry,” said OuYang Jian, Distinguished Architect of Baidu. “Baidu KUNLUN is a very challenging project since it requires not only a high level of reliability and performance at the same time but is also a compilation of the most advanced technologies in the semiconductor industry. Thanks to Samsung’s state of the art process technologies and competent foundry services, we were able to meet and surpass our goal to offer superior AI user experience. ”
“We are excited to start a new foundry service for Baidu using our 14nm process technology,” said Ryan Lee, vice president of Foundry Marketing at Samsung Electronics. “Baidu KUNLUN is an important milestone for Samsung Foundry as we’re expanding our business area beyond mobile to datacenter applications by developing and mass-producing AI chips. Samsung will provide comprehensive foundry solutions from design support to cutting-edge manufacturing technologies, such as 5LPE, 4LPE, as well as 2.5D packaging.”
Through this cooperation, Baidu aims to provide an advanced AI platform for maximising AI performance, while Samsung will be focussing on expanding its foundry business into High Performance Computing (HPC) chips, dedicated to cloud and edge computing.
At the same time, Samsung will also be developing advanced packaging technologies, such as redistribution layers (RDL) interposer and 4x, 8x HBM integrated package.