RECOM’s Low Profile QFN-Package Power Module


One of the smallest low profile QFN-packaged buck regulator power module that is exceptional due to its flip-chip technology which increases power density and improves thermal management

RECOM’s new power module offers a high power density footprint on a 4.5mm x 4mm x 2mm thermally-enhanced QFN package.

The RPX-2.5 provides an input range from 4.5 to 28VDC, allowing 5V, 12V or 24V supply voltages to be used. The output voltage can be set with two resistors in the range from 1.2V up to 6V. The maximum output current is 2.5A, and the output is fully protected against continuous short-circuits, output overcurrent, or over-temperature faults. It has an efficiency of up to 91%, and it is thermally optimized due to its flip-chip technology.


An integrated shielded inductor in this miniature package makes it optimal for space-constrained applications. To facilitate rapid testing, RECOM also offers an evaluation board for this product so that customers will be able to quickly and easily test.

Converter samples, evaluation boards, and OEM pricing are available from all authorized distributors or directly from RECOM.

Visit RPX-2.5 and RPX-2.5 evaluation board for more details.

Maxim’s PUF Key Protection Technology Enables Secure IoT MCU


Please enter your comment!
Please enter your name here

Are you human? *