Low Power Consumption SSD Controller With Advanced Security Features


New X1 SATA NAND flash controller offers lowest power consumption and security for industrial solid state drives (SSDs), M.2, U.2, CFast and embedded flash drives (eSSDs)

Hyperstone introduces its new X1 – SATA III SSD controller. The X1 is designed to fully satisfy industrial requirements and targets high-reliability and low power SSDs, M.2 and U.2 modules, CFast cards and system-in-package eSSDs or discrete on-board flash drive integration. With its state-of-the-art hyMap® sub-page-based flash translation layer, the X1 achieves unparalleled random write performance, minimal write amplification and high endurance without external DRAM. The newly introduced FlashXE® (eXtended Endurance) read-channel includes calibration, error correction with soft-decoding and error prevention mechanisms for a wide range of flash technology including SLC, pSLC, 3D MLC, 3D TLC and the next generation of NAND flashes.

Adherence to the highest industrial requirements is guaranteed by hyReliability™ flash management, which features superior wear leveling, read-disturb management and best-in-class power-fail robustness.


Furthermore, advanced protection against radiation and soft errors including end-to-end datapath protection, SRAM ECC and a low-alpha package ensure operation even under the most demanding conditions. The controller achieves transfer speeds of up to 550 MB/s. Exhaustive health-monitoring data exceeding the usual S.M.A.R.T. scope is provided together with lifetime estimation tools.

Key Features

  • 32-Bit dual-core microprocessor with optimized instruction set and additional hardware accelerators for flash memory handling.
  • Designed for 125°C junction temperature, but can be used in 105 °C environments.
  • Outstanding support and long term availability.

X1 is the latest addition to Hyperstone’s portfolio of NAND flash controllers, enabling industrial customers to benefit from the most reliable and most energy-efficient SSD solution.

Advanced Chipsets Bring Smart-Building Applications


The X1 will initially be available in 144-ball TFBGA (10.4 x 10.4 x 1.1 mm) and 124-ball TFBGA (9 x 9 x 1.2 mm) packages, qualified for the industrial temperature range (-40 to +85 °C). Mass-production samples and firmware are available now.



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