Vishay Intertechnology has made its T55 Series of Polymer Tantalum chip capacitors available in a lower profile size to enable the design of thinner end products
Vishay has extended its T55 series of vPolyTan surface-mount polymer tantalum molded chip capacitors with new devices in the Z case (EIA 7343-19) size. With a 0.1 mm lower height than devices in the standard V case (EIA 7343-20), the Vishay Polytech capacitors claim to increase package density and enable the design of thinner end products. The devices are optimized for power management, battery decoupling, and energy storage in computers, servers, network infrastructure equipment, solid-state drives, and wireless transceivers.
T55 series Polymer Surface Mount Chip Capacitors
Offered in the compact J, P, A, B, T (low-profile B — 1.2 mm max), D, V, and Z case sizes, the T55 series features a wide capacitance range from 3.3 µF to 680 µF over voltage ratings from 2.5 V to 63 V, and a capacitance tolerance of ± 20 %.
The capacitors boast an ultra-low ESR from 500 mΩ down to 7 mΩ at +25 °C, a result of their polymer cathodes, which offer greatly enhanced performance over manganese dioxide devices.
Capacitance values up to 1000 µF and ESR values down to 6 mΩ are in development, according to Vishay.
Operating over a temperature range of -55 °C to +105 °C, the capacitors offer excellent ripple current rating up to 5.66 A IRMS and provide low internal resistance for enhanced charge and discharge characteristics.
Featuring lead (Pb)-free terminations, the T55 series is RoHS-compliant, halogen-free, and Vishay Green.
The devices are compatible with high volume automatic pick and place equipment and offer a Moisture Sensitivity Level (MSL) of 3.
- Decoupling, smoothing, filtering
- Bulk energy storage in wireless cards
- Infrastructure equipment
Samples and production quantities of the T55 series capacitors in the Z case size are available now, with lead times of 12 to 14 weeks.
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