To optimize the design of IoT devices, Infineon is offering an industrial-grade embedded SIM (eSIM) in a miniaturized 2.5 x 2.7mm package
Machine-to-machine communication in the Internet of Things (IoT) requires reliable data collection and uninterrupted data transmission. Infineon is providing what it says is the world’s first industrial-grade eSIM in a miniature Wafer-level Chip-scale Package (WLCSP) to help manufacturers of IoT devices to take full advantage of the ubiquitous mobile networks.
According to the firm, the solution will help manufacturers of industrial machines and equipment ranging from vending machines to remote sensors to asset trackers to optimize the design of their IoT devices without compromising on security and quality.
Advantages of eSIM
Deploying eSIM brings a number of advantages for a smooth adoption of cellular connectivity into industrial environments. Device manufacturers can increase their design flexibility due to the eSIM’s small footprint, and simplify manufacturing processes as well as global distribution thanks to a single stock-keeping unit. Customers also have the possibility to change their mobile service provider at any time, for example, if the quality of the network deteriorates or in the event of a better contract from the mobile operator.
However, providing robust quality on a miniature footprint that works even under harshest conditions remains a challenge for silicon providers.
Infineon’s new solution helps to address this challenge. The company’s SLM 97 security controller in a Wafer Level Chip Scale Package (WLCSP) measures only 2.5mm x 2.7mm in size, supports an extended temperature range of -40 to 105° Celsius. It claims to provide a high-end feature set fully compliant with the latest GSMA specifications for eSIM. It offers robust quality and high endurance for industrial eSIM applications.
The SLM 97 security chip in WLCSP is now available in volume quantities. More information is available here.