Highly-integrated Chips Suit Next-Gen Aerospace and Defense

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Xilinx’s new XQ UltraScale+ products offer extended temperature ranges and ruggedized packaging to address the demands of the aerospace and defense industry.

aerospace and defenseXilinx has announced the availability of its Defense-grade XQ UltraScale+ portfolio of products — encompassing the XQ Zynq UltraScale+ MPSoCs and RFSoCs as well as XQ UltraScale+ Kintex and Virtex FPGAs. The company says these products suit harsh environments, where the highest levels of security and reliability are critical, and size, weight and power (SWaP) are key considerations.

The highly integrated programmable SoC offers key advantages over alternative approaches, which typically require customers to source and use multiple chips. In addition to SWaP benefits, the devices provide many other benefits that make them ideally suited for applications in civil and military aircraft as well as other defense systems requiring support for extended temperature ranges, rugged environments, long life and the highest levels of security.

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The products utilize the TSMC’s 16nm FinFET process and claim to attain a minimum twice the performance-per-watt of preceding-generation systems.

This portfolio includes what the company says as the industry’s first Defense-grade heterogeneous multi-processor SoC devices, combining flexible and dynamically reconfigurable high-performance programmable logic and DSP, 16Gb/s and 28Gb/s transceivers, quad-core Arm Cortex-A53 embedded processors, and dual-core Arm Cortex-R5 embedded processors.

In addition, optionally available features include high-speed 4Gsps ADCs and 6.4Gsps DACs, Arm Mali-400 GPU, 4k60 H.265/H/264 video codec, and ruggedized packages with support of -55oC to 125oC and 256-bit physical unclonable function (PUF).

“With more than 30 years of continuous focus and heritage in the aerospace and defense industry, we’re excited to announce the industry’s most advanced Defense-grade product portfolio for our customers,” said David Gamba, senior director of aerospace and defense, Xilinx. “This line builds on our currently available UltraScale and 7 Series Defense-grade families, giving our customers a variety of powerful options to meet their most demanding applications.”

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Available features for the Defense-grade XQ UltraScale+ products include:

  • Ruggedized packaging
  • MIL-STD-883 group D Qualification testing
  • Military-temperature range (-55oC to 125oC)
  • Full range extended temperature testing
  • Mask set control
  • Full compliance with MIL-PRF-38535 Pb content standards
  • Longer-term availability
  • Anti-counterfeiting features
  • Available information assurance (IA) methodology
  • Available anti-tamper (AT) technology

Availability

Initial UltraScale+ Defense-grade products are available now. For more information, click here.

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