RECOM’s latest innovation increases the power density of DOSA-packaged DC/DC converters to a new level.
RECOM’s RPM power modules are successfully designed, tested, and manufactured. They are SMD with a land-grid-array package, and with input and output capacitors already included, the RPM series operates without the need for additional components.
High power density (L*W*H = 12.19*12.19*3.75 mm)
Wide operating temperature from -40°C up to +107°C at full load
Efficiency up to 99%, no need for heatsinks
Thermally and EMI enhanced 25 pad LGA package
Compact DOSA-compatible footprint
The RPM modules stand out due to their exceptional efficiency of up to 99%, enabling a low-profile package perfect for applications where space is critical.
RECOM’s new power modules offer one of the highest power densities in a DOSA footprint on the market with a profile of only 3.75mm. They provide either 1, 2, 3, or even 6A in the same-sized package for scalability. The 6A module has at least 50% higher power density than its peers on the market, thanks to a new IC and a novel multi-layer PCB layout.
They are thermally optimized to pull the heat away from the board – so without derating it delivers over 800W/in³ at up to 90°C. With a ground plane in the PCB together with the metal housing, 6-sided shielding guarantees great EMC performance.
The RPM power modules have been successfully designed, tested, and manufactured – all in Europe. With input and output capacitors already included, the RPM series operates without the need for additional components. They are SMD with a land-grid-array package.
To facilitate rapid testing, RECOM also developed evaluation boards, which will be released by end of October 2018 so that customers will be able to quickly and easily test these modules.