Improved Debug, Programming Probe for MCUs

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Faster, more flexible probe from STMicroelectronics eases STM8 and STM32 programming on the bench or in the field

Embedded design engineers can now improve their development experience with STMicroelectronics’s new STLINK-V3 probe. ST claims that the probe further increases flexibility and efficiency for programming and debugging embedded systems centered on STM8 and STM32 microcontrollers.

ST improves debug probe for STM8 and STM32 MCUs

The competitively priced STLINK-V3 now features mass-storage support, a virtual COM port with multipath bridge, and three-times faster write performance, which ST says saves development time and easily reprograms devices in the field.

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In addition to providing typical JTAG/Serial-Wire Debug (SWD) and Single-Wire Interface Module (SWIM) connections, STLINK-V3’s Virtual COM Port (VCP) and multipath bridge allow communication through the microcontroller UART, I2C, SPI, or CAN interface, or GPIOs. This lets developers conveniently automate tests using custom control commands and observe run-time data on the host PC, or use the STLINK-V3 to program devices with a bootloader and simplify product maintenance, according to ST.

Major development tools already support STLINK-V3, allowing users to take advantage of the powerful features from within a convenient graphical environment such as the STM32Cube programmer and Integrated Development Environments (IDE) such as Keil MDK-ARM, IAR EWARM, and GCC-based IDEs. ST also allows free access to STLINK-V3 low-level APIs, to facilitate integration with custom or automated test platforms.

Supplied as a complete kit, the STLINK-V3SET contains the probe, debug connector, cables, and an adapter board that supports SWIM-specific features and provides access to signals from the multipath bridge. Users can further expand functionality cost-effectively with additional boards such as a voltage-translator module.

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Availability

STLINK-V3SET is available now for $35.00 from www.st.com, or through distributors.

Click here for further information.

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