Miniature strain gauge from Micro-Measurements enables quick and accurate detection of PCB surface strains at critical locations in consumer electronics.
Miniaturizing consumer electronics will result in higher component density, increased thermal stresses, new requirements for surviving repeated loadings, and a larger need for impact stress survival. In order to meet these requirements, precise knowledge of strains in the PCB and on-board components is a must. The most accurate, swift, and cost-effective manner to detect strains on a PCB is through strain gage measurement, which can also be used in developing loading fixtures and test plans to optimize the testing phase.
The Micro-Measurements brand of Vishay has introduced the G1350 C2K-Series strain gage, a miniature stacked rectangular rosette sensor built to meet the developing need for precise, consistent, and reliable stress analysis of PCBs, even in severe environments.
New C2K series strain gauges offer small size and higher resistance
The G1350 is designed to detect PCB surface strains at critical locations in consumer electronics. The miniature strain gage is particularly advantageous in applications that can benefit from its small size and higher resistance of 120 ohms and 350 ohms, according to the company.
Typical applications for the G1350 include Structural Health Monitoring (SHM), Industrial Internet of Things (IIoT), autonomous vehicles, instrumentation & control, machinery & equipment, motion control, Industry 4.0, robotics, smart cities, smart manufacturing, smart infrastructure, wearable electronics, and wireless applications.
The new line of C2K series strain gages is based upon advanced technology manufacturing processes that allows high resistance in small-sized gage patterns. The uniaxial linear stacked rosette C2K-06-G1350-350 features an active grid length of just 0.040” and an overall matrix of 0.20”diameter to allow spot-on installation on surface-mount components. The 3 meters of pre-attached three-conductor cable is built to ease and speed-up installation processes by eliminating the need of lead wire soldering after bonding, said the company.
The new strain gage features a Modified Karma, or K-alloy (C2K), and an epoxy overcoat for grid encapsulation. Categorized by strong fatigue life and excellent stability, K-alloy strain gages can be exposed to temperatures as high as +150°F (+66°C).
As required by standards in the electronics industry, PCAs must be tested to determine if the design can withstand the rigor of manufacturing, packaging, transporting, and day-to-day use of electronic devices.
Some of the methods in the process in which strain gages are used for printed circuit assembly testing include: ensuring appropriate surface preparation materials are on hand, selecting an adhesive, selecting a protective coating that will resist environmental conditions, and selecting the measurement instrumentation.
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