Bluetooth 5 SiP Module For IoT & Wearables

bluetooth 5

On Semi’s new Bluetooth 5 chip significantly reduces design efforts, costs and time-to-market for wearables and IoT devices.

The latest version of the Bluetooth standard, Bluetooth 5, is revolutionizing IoT with a wide range of enhancements such as longer range, faster speed, and transformative wireless connectivity. A new Bluetooth 5 ready chip from On Semi packs a bunch of features to meet the demands of today’s IoT and connected wearable devices. The chip claims to offer ultra-low-power wireless connectivity and advanced wireless features while optimizing system size and battery life.

Tiny BLE 5 SiP Simplifies Design Of ‘Smart Connected’ Applications

ON Semiconductor has extended its RSL10 family of Bluetooth 5 certified radio System-on-Chips (SoCs) with a ready-to-use 6 x 8 x1.46 mm System-in-Package (SiP) module. Supporting Bluetooth low energy wireless profiles, RSL10 devices can be easily designed into any ‘connected’ application including sports/fitness or mHealth wearables, smart locks and appliances.


The RSL10 SIP is a miniature solution featuring a built-in antenna, RSL10 radio, and all required passive components.

Certified with the Bluetooth Special Interest Group (SIG), the RSL10 SIP significantly reduces time-to-market and development costs by removing the need for any additional RF design considerations, ON Semi claims.

Offering two megabits per second (Mbps) speeds possible with Bluetooth 5 as well as industry’s lowest power consumption, the RSL10 claims to provide advanced wireless functionality without compromising battery application life.

According to the announcement, RSL10 consumes just 62.5 nanowatts (nW) while in Deep Sleep mode, and 7 milliwatts (mW) peak receive power. RSL10’s energy efficiency was recently validated by the EEMBC’s ULPMark where it became the first device in the benchmark’s history to break 1,000 ULP Marks and produced Core Profile scores more than twice as high as the previous industry leader.

Next-Gen IoT & Wearables Leverage DDC For Ultra-low-power Designs

“With its best-in-class power consumption, it’s not surprising that RSL10 has already been selected for use in a number of applications including energy harvesting and industrial IoT,” said Michel De Mey, senior director and general manager of Hearing, Consumer Health, and Bluetooth Connectivity solutions at ON Semiconductor. “By adding a new System-in-Package that significantly reduces design efforts, costs and time-to-market, the possibilities for RSL10 are endless.”


The RSL10 SIP is offered in a 51-pin 6 x 8 x 1.46 mm package. Designers can order samples or an Evaluation Board by contacting their local ON Semiconductor sales representative or authorized distributor.



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