Industry Alliance Aims 48V Developments For Data Centers


Four suppliers of power solutions have launched the Power Stamp Alliance which aims to create collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters. These 48V direct conversion DC-DC modules – or ‘power stamps’ – primarily target high-performance computers and servers being used in large data centers, many of which follow the principles of the Open Compute Project (OCP). The Founding Members of the alliance are Artesyn Embedded Technologies, Bel Power Solutions, Flex, and STMicroelectronics.

The alliance has been formed to define a standard product footprint and functions that provide a multiple sourced, standard modular board-mounted solution for power conversion for 48Vin to low-voltage, high-current DC-DC applications.

“By creating and sharing a specification for a standard product footprint and functions, the Power Stamp Alliance has created a multi-vendor ecosystem to assure practical levels of alternate source capability to server and storage system manufacturers, while encouraging a competitive supply chain through differentiation in topology, circuitry, and performance from multiple, independent manufacturers”, the announcement stated.


The first processor architectures addressed by the Power Stamp Alliance include the Intel VR13 Skylake CPUs, Intel VR13-HC Ice Lake CPUs, DDR4 memories, IBM POWER9 (P9) processors and high-current ASIC and/or FPGA chipsets supporting the SVID or AVS protocols.

“The Power Stamp Alliance has developed an onboard power solution that meets the needs of hyperscale data center operators with a particular focus on supporting high-performance compute servers,” said Maggie Shillington, research analyst for IHS Markit, a global information provider. “By setting only the form factor and core functionality of the power stamp, the Power Stamp Alliance enables individual companies to leverage their expertise to provide distinct, yet compatible solutions. This allows for a potential thriving ecosystem of providers in the power stamp market.”

The PSA has published specifications, drawings and pin-out descriptions for main and satellite power stamps at

Press release;




Please enter your comment!
Please enter your name here

Are you human? *