To address the emerging industrial imaging applications such as machine vision inspection and industrial automation, ON Semiconductor has announced its X-Class image sensor platform, which allows a single camera design supporting multiple sensors across the platform.
The first devices in the new platform are the 12MP XGS 12000 and 4k / UHD resolution XGS 8000 image sensors for applications such as machine vision, intelligent transportation systems, and broadcast imaging.
The X-Class image sensor platform is noteworthy for camera design since it supports multiple CMOS pixel architectures through a common high bandwidth, low power interface that allows camera OEMs to leverage existing parts inventory while at the same time accelerate time to market for new camera designs.
The XGS 12000 provides 12 MP (4096 x 3072 pixel) resolution in a one-inch optical format to supply the imaging detail and performance needed for modern machine vision and inspection applications. It is planned to be available in two-speed grades – one that fully utilizes 10GigE interfaces by providing full resolution speeds up to 90 fps, and a lower price version providing 27 fps at full resolution that aligns with the bandwidth available from USB 3.0 computer interfaces.
The XGS 8000 provides 4k / UHD (4096 x 2160 pixels) resolution in a 1/1.1 inch optical format and is planned to be available in two-speed grades (130 and 75 fps), making the device ideal for broadcast applications.
“As the needs of industrial imaging applications such as machine vision inspection and industrial automation continue to advance, the design and performance of the image sensors targeting this growing market must continue to evolve,” said Herb Erhardt, Vice President and General Manager, Industrial Solutions Division, Image Sensor Group at ON Semiconductor. “With the X-Class platform and devices based on the new XGS pixel, end users have access to the performance and imaging capabilities they need for these applications, while camera manufacturers have the flexibility they require to develop next-generation camera designs for their customers both today and in the future.”
The XGS 12000 and XGS 8000 will begin sampling in the 2Q2018, with production availability scheduled for the 3Q2018. Both devices will be available in 163-pin LGA packages in monochrome and color configurations.
More information: http://www.onsemi.com/PowerSolutions/newsItem.do?article=4043