Innovative PoP Components Provide Up to 1,000A Peak Currents


Vicor Corporation has announced new Power-on-Package (PoP) components including Modular Current Multipliers (“MCMs”) that offer dramatic performance improvements over conventional power solutions for high performance, high current XPUs (CPUs, ASICs or GPUs). PoP enables XPUs to achieve previously unattainable performance levels which are required for demanding applications such as Artificial Intelligence (AI) processors and 48V autonomous driving systems, Vicor said.

A pair of MCM4608S59Z01B5T00 (MCMs) and MCD4609S60E59H0T00 Modular Current Multiplier Driver (MCD) provide 600A continuously and up to 1,000A peak at up to 1V. 

PoP MCMs multiply current and divide voltage from a 48V source in close proximity to XPUs to enable higher levels of XPU performance.


In the announcement, the company explained: “Power distribution efficiency and system density rise beyond the limitations of conventional 12V input multi-phase voltage regulators lacking current multiplication. PoP is an enabling tech for high current AI processors and 48V autonomous driving systems.”

Owing to their high density, low profile package (46 x 8 x 2.7mm) and low noise attributes, MCMs are suitable for co-packaging within the XPU substrate or adjacent to it. PoP MCDs supply power at 48V to the MCMs, which multiply current and divide voltage. The close proximity of the MCM to the XPU eliminates substantial power loss and bandwidth limitations incurred in the “last inch” of the current delivery path from the boundaries of 12V multi-phase regulators.

Vicor noted that PoP modules build upon Factorized Power Architecture (FPA) systems deployed in high-performance computers and large-scale data centers. FPA supports efficient power distribution and direct conversion from 48V to sub-1V XPUs. With current multiplication deployed in close proximity to high current processors, PoP MCMs overcome previous barriers to improved performance.

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Click here for Press release

Learn more about Power on Package Technology.



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