Pickering Electronics plans to showcase the world’s highest density Reed Relay at Semicon Korea 2018, on booth A611. Requiring a board area of only 4mm x 4mm, they are claimed the highest packing density reed relays currently available.
The 4mm x 4mm reed relays take up the smallest board area ever.
The company released its new Series 120 4mm2 reed relay range in 2017 at Semicon West in San Francisco.
Two switch types will be available, a general purpose sputtered ruthenium switch rated at 15 Watts, 1 Amp (3 Volt version) or 20 Watts, 1 Amp (5 & 12 Volt versions) and a low level sputtered ruthenium switch rated at 10 Watts, 0.5 Amps.
To allow this very high density, the reed switches are orientated vertically within the package,
The small size of the package does not allow an internal diode. Back EMF suppression diodes are included in many relay drivers but if they are not, and depending on your drive methods, these may have to be provided externally.
In the figure, there are a total of 528 Series 120 relays on Pickering Interfaces ultra-high-density PXI module. This illustrates the packing density of these extremely small Reed Relays.
The relays feature an internal mu-metal magnetic screen. Mu-metal has the advantage of a high permeability and low magnetic remanence and eliminates problems that would otherwise occur due to magnetic interaction. Relays of this small size without magnetic screening would be totally unsuitable for applications where dense packing is required.
More information: http://www.pickeringrelay.com/2017/11/06/reed-relay-productronica-2017/