As more automotive systems are expected to use 3D graphics instrument cluster systems in the near future, Renesas has launched its high-performance R-Car D3 automotive infotainment chip designed to expand the use of 3D clusters that support 3D graphics displays in entry-class cars. The R-Car D3 SoC is said to achieve both high-performance graphics capabilities and contributes to significant reduction in overall system development cost.
The new SoC enables a high-quality 3D display and lower system costs equivalent to the bill of materials (BOM) costs of developing with 2D graphics instrument clusters (2D clusters).
The R-Car D3 chip lets system developers re-use their 3D graphics development assets, including software and graphics designs from high-end vehicles using high-performance R-Car H3 or R-Car M3 SoCs to entry-level cars. This scalability enables development of easy-to-use and high visibility entry cluster 3D graphics at approximately the same level cost as the existing 2D clusters, says Renesas.
“Full graphics cluster systems equipped with a large thin filter transistor panel are expected to become mainstream for future vehicles, which will require high-definition 3D graphics display at a high speed to accurately convey information to the driver,” said Toshiaki Ichihashi, Managing Officer, Engineering Headquarters, Nippon Seiki Co., Ltd. “We are excited that the R-Car D3 will respond to this need as well as reduce BOM costs.”
“For more than a decade, automotive OEMs and Tier 1s have relied on BlackBerry QNX to deliver world-class software solutions for infotainment, telematics, and instrument cluster systems,” said Grant Courville, senior director of product management at BlackBerry QNX. “The combination of the new R-Car D3 SoC and BlackBerry’s ISO 26262 ASIL B-certified QNX Platform for Instrument Clusters will enable our customers to confidently deliver state-of-the-art, safety-certified digital clusters rapidly to the market.”
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