Toshiba has pushed the boundaries of flash memory technology by launching its new 4-bit-per-cell, quadruple-level cell (QLC) 3D flash memory which claims to achieve world’s largest capacity of 1.5TB in a single package. The new QLC device claims even higher storage density at lower costs for enterprise and consumer SSDs, tablets and memory cards.
The new BiCS FLASHTM 3D flash memory is believed to solve many of the challenges facing datacenters today, such as reducing power consumption and lowering footprint.
The memory device features the company’s BiCS 3D manufacturing technology and a 64-layer stacked cell structure. It claims larger (768 gigabit) die capacity than the company’s third-generation 512Gb memory employing 3-bit-per-cell, triple-level cell (TLC) technology.
Further, the new QLC dies can be stacked in a 16-die package to create 1.5TB of storage in a single package – claimed to be the industry’s largest capacity. This is a fifty percent increase in capacity per package when compared to Toshiba’s earlier 1TB device with a 16-die stacked architecture in a single package.
Toshiba said that the technical challenges posed by QLC technology in 3D flash memory are overcome by combining its advanced circuit design and leading 3D flash memory process technology.
“Higher capacity HDDs lead to an increase in areal density and drives up the weight. It has become common to see a 42U rack only half-filled due to exceeding maximum weight or power supply”, Toshiba noted.
In contrast, flash memory-based storage solutions weigh less and realize improved power efficiencies, enabling datacenters to achieve maximum rack capacity.
“From SLC to MLC and MLC to TLC, large technology shifts are often met by industry resistance and the introduction of QLC is no exception,” noted Scott Nelson, senior vice president of TAEC’s memory business unit. “There will always be demand for compelling storage solutions that bring higher densities and produce a favorable cost/performance equation – our QLC technology falls squarely into that sweet spot. History has proven us right in the past when it comes to our visionary flash memory roadmap, and we fully expect QLC BiCS FLASH to continue our industry-leading track record.”
Samples of the new QLC device began shipping earlier in June to SSD and SSD controller vendors for evaluation and development purposes.
Additionally, samples will be showcased at the 2017 Flash Memory Summit, taking place from August 7-10 in Santa Clara, California.
For more information, visit www.toshiba.semicon-storage.com