Melexis has unveiled a new Time-of-Flight (ToF) 3D vision chipset and development kit to implement simple, robust 3D vision solutions. Typical applications include gesture recognition, driver monitoring and occupant detection in automotive applications, industrial applications (e.g. conveyer belts, robotics and volume measurement), as well as Smart Cities (people counting, security, etc.).
The newly available chipset includes the MLX75023 1/3-inch optical format ToF sensor and the MLX75123 companion IC that embeds many of the external components normally required to develop a 3D vision solution. This allows designers to save cost, time and space required by external FPGAs and ADCs.
The ToF sensor is claimed to offer the world’s smallest pixel at QVGA resolution with 63 dB linear dynamic range and sunlight robustness leveraging advanced pixel technology, says Melexis.
The MLX75123 companion chip directly interfaces the sensor IC to a host MCU and provides rapid readout of data from the sensor.
According to the firm, the modular approach taken in designing the chipset means that the sensor can be changed / upgraded without having to change the product architecture. This allows the design of multiple solutions with the same base design as well as rapid implementation of new sensors as they reach the market.
Gaetan Koers, Product Manager for Melexis commented: “We are very excited about the possibilities the launch of this chipset unleashes. The simplicity that it brings to the design process will ensure that more applications will be able to benefit from 3D TOF vision. In this fast-moving technology sector the in-built future proofing will mean that our customers will be able to remain at the leading edge for years to come.”
The chipset is available in both automotive (-40°C to +105°C) and industrial (-20°C to +85°C) applications.
For further details, view the full Press release.