MOSFETs Enable Designers Build Smaller Vehicle ECUs


STMicroelectronics has introduced new automotive MOSFET devices in a tiny 5x6mm dual-side cooling (DSC) package, that increases power density in automotive Electronic Control Units (ECUs), enabling designers to build smaller ECUs. The MOSFETs are already being used by Denso, a leading supplier of advanced automotive technology to all major car makers and are the first in a series of new devices.

The STLD200N4F6AG and STLD125N4F6AG 40V power MOSFETs are designed for automotive motor-control, reverse-battery protection, and high-performance power switching applications.

The speciality of the new 0.8mm-high PowerFLATTM 5×6 DSC is that it retains the footprint and thermally efficient bottom-side design of the standard package, while it exposes the top-side source electrode to further enhance heat dissipation. “This allows a higher current rating that increases power density, enabling designers to build smaller ECUs without trading off functionality, performance, or reliability”, according to ST.

The MOSFETSs feature a maximum drain current of 120A and maximum on-resistance of 1.5 mΩ and 3.0 mΩ, respectively, ensure high energy efficiency and help simplify system thermal management. In addition, total gate charges of 172nC and 91nC, with low device capacitances, permit efficient switching at high operating frequencies.


The new MOSFETs are specified for operation in extremely harsh conditions including under-the-hood temperatures up to 175°C.

The devices are 100% avalanche-rated and offered in a package with wettable flank leads for optimum soldering and 100% Automatic Optical Inspection.

The STLD200N4F6AG and STLD125N4F6AG have been AEC-Q101 qualified and are available now with prices starting from $1.15 for orders of 1000 pieces. In addition, ST says that the family will be extended with STripFET F7 devices this year.

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For further information, view the full Press release.



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