New Chip Paves Way For Smartphones With 8GB Of DRAM!


Samsung Electronics introduced the industry’s first 8GB LPDDR4 (low power, double data rate 4) mobile DRAM package, which it claims has twice the capacity and twice the speed of typical DRAM used in PCs.  The new memory chip paves the way for high-end mobile phones, ultra-thin notebooks, and tablets with 8GB for RAM.

The 8GB LPDDR4 measures 15 x 15 x 1.0 mm, which satisfies space requirements of most new, ultra slim mobile devices. It packs four 16 gigabit (Gb) LPDDR4 memory chips and utilises advanced 10nm process technology.

“The advent of our powerful 8GB mobile DRAM solution will enable more capable next-generation, flagship mobile devices around the world,” said Joo Sun Choi, executive vice president of Memory Sales and Marketing at Samsung Electronics. “We will continue to provide advanced memory solutions offering the highest values and leading-edge benefits to meet the escalating needs of devices having dual camera, 4K UHD and VR features.”

Samsung notes that the new chip operates at up to 4,266 Mbps, which is twice as fast as DDR4 DRAM for PCs working typically at 2,133 Mbps per pin.


While many high-end ultra-slim note PCs use 8GB of DRAM currently, Samsung’s new 8GB LPDDR4 package will help other next-generation mobile devices take full advantage of its extremely high capacity. For example, equipping tablets with 8GB of LPDDR4 will enable virtual machine operation and smoother 4K UHD video playback, popular features of many premium PCs.

Using latest 10nm process technology and low-power circuit design, the new DRAM offers low power consumption. This enables the chip to double the capacity of the company’s 20nm 4GB DRAM package, while consuming approximately the same amount of power.

High Operating Temperature FIR Thermal Sensor Array

Further space-savings on the PCB is possible by using a DRAM package thinner than 1.0mm which enables stacking the package together with UFS memory or a mobile application processor.

The firm plans to also use the 10nm-process technology in other fabs in the near future, to meet ever-increasing demands for advanced, high-density mobile DRAM.

For further details, view the full Press release.



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