To solve the pressing challenge of having too many incompatible interfaces on one device, Lattice Semiconductor claims the industry’s first programmable bridging chip which supports leading protocols for mobile image sensors and displays. The new device is an optimal solution for virtual reality headsets, drones, smartphones, tablets, cameras, wearable devices and human machine interfaces (HMIs).
The new CrossLink programmable bridging device is claimed to be the world’s fastest MIPI D-PHY bridging device that delivers up to 4K UHD resolution at 12 Gbps bandwidth. Further, it consumes the lowest power in active mode and offered in an industry’s smallest package size with a 6 mm2 option.
“Taking the strongest features from ASSPs and FPGAs, the device combines the flexibility and fast time to market of an FPGA with the power and functional optimization of an ASSP (application-specific standard product) to create a new product class called programmable ASSP (pASSP)”, the company said.
Interfaces supported include popular mobile, camera, display and legacy interfaces such as MIPI D-PHY, MIPI CSI-2, MIPI DSI, MIPI DPI, CMOS, and SubLVDS, LVDS and more.
“The latest wave of image capture and display technology, including drones and VR, is creating real industry excitement. Combining these new technologies with a global base of 3.7 billion smartphones and tablets that’s set to rise more than 30 percent by 2020, all equates to a wide variety of interfaces that must be integrated to ensure compatibility,” said Carl Hibbert, associate director of entertainment content and delivery, Futuresource Consulting. “The ability to manage these interfaces through a low cost, low power and small footprint bridging solution is essential.”
Image sensor applications of the chip include multiplexing, merging and arbitrating between multiple image sensors to a single input. The device can also interface between high-end industrial and popular A/V image sensors with mobile application processors. This is ideal for 360, action, surveillance and DSLR cameras along with drones, augmented reality products and more.
One display application of the CrossLink device is that it can receive video data from one MIPI DSI interface and send it out over two MIPI DSI interfaces at half the bandwidth. The same video stream can be split to two interfaces, ideal for virtual reality headsets and mobile set top boxes.
Customers can use the bridge IC to integrate consumer and industrial panels with RGB or LVDS interfaces with mobile applications processors. The chip can convert from MIPI DSI to multiple lanes of CMOS or LVDS interfaces such as MIPI DPI, OpenLDI and proprietary interface formats for HMIs, smart displays, smart homes and more.
CrossLink evaluation boards are available now while production devices will be available shortly in amazingly small 2.46 mm x 2.46 mm WLCSP packages and BGA packages with 0.4 mm, 0.5 mm and 0.65 mm pitch.
For further details, view the full Press release.