CML Microcircuits has announced a new digital voice chip providing a complete end to end function with dual channel encoding, decoding, transcoding with no external DSP or DSP skills required, claims the company. The device is ideally suited to software-defined radio (SDR), voice-over IP (VoIP) applications, wireless private branch exchange (PBX) and digital voice interconnect systems.
The CMX7261 features voice encoding and decoding through an Analogue Front End or transcoding operations over its digital interfaces. Both half-duplex and full-duplex modes are available. The chip implements the G.723.1 digital voice coding algorithm of VoIP applications.
The transcoder utilises CML’s proprietary FirmASIC component technology. On-chip sub-systems are configured by a Function Image data file that is uploaded during device initialisation and defining the device’s function and feature set. The Function Image Host can be loaded by the host or auto-loaded from an external serial memory.
Two Function Images are currently available. These cover Linear PCM, G.711, G.729A and CVSD algorithms and Linear PCM, G.711 and G.723.1 algorithms, making the device very flexible and with the ability to deliver high quality speech for a large number of applications without sacrificing performance.
The CMX7261 guarantees quality audio and speeds equipment design cycle with complete analogue to digital, digital to analogue or digital to digital conversion. Other key features include voice activity detection, C-BUS (SPI compatible) host serial control/data interface, multiple choice of input and output sources, streaming transfers, GPIO and encoder/decoder test mode support that allows verification of bit exactness and high audio quality for supported codecs.
The device’s functions and features can be enhanced by subsequent Function Image releases, simplifying in-the-field upgrades. It operates from a 3.3V supply and includes selectable powersaving modes
An Evaluation Kit PE0601-7261 is available. The new device is available in small 64-pin VQFN/LQFP package.
For further details, view the full Press release.