Maxim Integrated is shipping the industry’s first transceiver chip for development of SFP28 modules for data center and radio fronthaul applications. The chip avoids a driver inside the transmit optical subassembly (TOSA) and allows module manufacturers to use TO-cans to keep heat away from the sensitive laser, simplify production and improve yields.
The solution offers several key advantages including reduced module BOM through the use of low-cost TO-can based optics. In addition, the module accelerates time to market with digital eye tuning at the output which reduces design spins. Production costs are reduced with reuse of TO-can-based 10Gbps manufacturing flow which improves yield.
The SFP28 module can simply be designed in the same way as an SFP+ module using TO optics, one transceiver IC, and one controller IC. The new low-power transceiver chip is optimised specifically for requirements which SFP28 modules need to fulfil. These are cost benefits over SFP+ module, while still having low power and a wide operating temperature range. The chip features a CDR and laser driver in the transmit path, and a high sensitivity limiting amp and CDR in the receive path.
“Maxim’s SFP28 transceiver builds on our proven 100Gbps technology and gives the industry what it needs to move to higher bandwidth interconnect,” said Andrew Sharratt, Director of Business Management at Maxim Integrated. “Shipping now to customers who are already in mass production, Maxim’s SFP28 IC enables cost effective upgrades to enterprise, hyperscale data center, and radio access networks.”
“Demand for SFP28 modules will experience strong growth over the next five years, as the market moves from 10Gbps per lane to 25Gbps,” said Dale Murray, Principal Analyst at LightCounting Market Research. “With its new transceiver IC, Maxim is poised to support this move by simplifying module design and lowering costs.”
The modules are specified over the -40-degree Celsius to +100-degree Celsius temperature range and available now.
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