ARM and TSMC are collaborating on the development of a 7nm process technology in order to produce future low-power, high-performance ARM architecture chips. The agreement will expand the companies’ advanced process technologies beyond mobile into next-generation networks and data centres. The joint effort is part of the previous collaborations of the firms for 16nm and 10nm FinFET production processes.
ARM chips are already powering million of smartphones and tablets. Data centre and network equipment are other areas which can benefit from the power-efficiency of new 7nm ARM chips. ARM is striving towards power efficienct chips which are important for the smartphones batteries to long laster. They will also allow data centers to consume less electricity.
“Existing ARM-based platforms have been shown to deliver an increase of up to 10x in compute density for specific data center workloads,” said Pete Hutton, executive vice president and president of product groups, ARM. “Future ARM technology designed specifically for data centers and network infrastructure and optimized for TSMC 7nm FinFET will enable our mutual customers to scale the industry’s lowest-power architecture across all performance points.”
“TSMC continuously invests in advanced process technology to support our customer’s success,” said Dr. Cliff Hou, vice president, R&D, TSMC. “With our 7nm FinFET, we have expanded our Process and Ecosystem solutions from mobile to high performance compute. Customers designing their next generation high-performance computing SoCs will benefit from TSMC’s industry-leading 7nm FinFET, which will deliver more performance improvement at the same power or lower power at the same performance as compared to our 10nm FinFET process node. Jointly optimized ARM and TSMC solutions will enable our customers to deliver disruptive, first-to-market products.”
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