X-Fab Silicon Foundries has announced that it is ready to produce silicon carbide (SiC) wafers with a diameter of six inches from its wafer fab in Lubbock, Texas.
In order to start supplying SiC wafers, X-FAB has upgraded its manufacturing resources by adding tools such as a high-temperature anneal furnace, backgrind equipment for thinning SiC wafers, backside metal sputter and backside laser anneal tools. A high-temperature implanter is scheduled for installation later this year.
X-FAB will be able to present to the market large volumes of SiC devices on 6-inch wafers leveraging its economies of scale that are already available in its established 30K wafer per month silicon line. X-FAB will not only supply fabless semiconductor vendors but also serve as a second source solution for IDMs with their own SiC manufacturing.
Apart from X-FAB’s 6-inch wafer capabilities, the company is expected to have high yields and will ramp up SiC 6-inch wafers to full scale production. Another supporting factor is XFAB’s extensive experience in manufacturing semiconductor devices which adhere to the most stringent quality standards, such as those for automotive applications.
“Current SiC offerings are either IDMs creating their own products or relatively small foundry operations using 4-inch production facilities,” states Andy Wilson, X-FAB’s Director of Strategic Business Development. “X-FAB is bringing something different to the market, with a SiC capacity of 5k wafers/month ready to utilise and potential to raise this further. We can thus offer a scalable, high quality, secure platform that will enable customers to cost-effectively obtain discrete devices on SiC substrates and also safely apply vital differentiation.”
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