ROHM is mass-producing two-system Power Management Integrated Circuits (PMICs) optimised for low power which will enable fanless designs of space-conscious mobile PC products such as Ultrabooks and tablets built around Intel’s 14nm Skylake processor.
Compared with discrete solutions, the dual-PMIC chipset reduces the number of peripheral components by 18 per cent and mounting area by 33 per cent, contributing to greater space savings and increased system size reduction.
The BD99991GW PMIC is designed for Intel’s IMVP8 power management interface and the core power rails required by the Skylake platform, while the BD99992GW is designed to provide the additional 10 power rails required for the rest of platform.
The PMICs, which are said to feature industry-leading power efficiency, can enable further reduction in power consumption, mounting area, and number of external parts, when matched with ROHM-optimised discrete components.
“We have been shipping the previous generation BD99990GU PMIC for the Broadwell platforms for a couple of years. These new PMICs not only inherit the advantages of the BD99990GU, but also feature design enhancements optimized for Intel’s latest platform (Skylake). The BD99991GW and BD99992GW are offered in a sealed WL-CSP (Wafer Level Chip Scale Package) form factor ideal for Type 4 PCBs that reduce footprint by 44 per cent over our previous IC, allowing for even further system size reduction,” said Jun Iida, Director of LSI Product Development at ROHM. “In addition to the required power functions, other features, such as LED driver, GPIOs, A/D converter, multiple clock generators, and coin battery charger, are built in. This contributes to significantly reduce the customers’ design efforts.”