Morfis Semiconductor has announced a single-die flip-chip RF front end to support all 2G/3G/4G LTE frequency bands. The solution is claimed to be the world’s smallest family of fully integrated CMOS, single-chip, single-die, flip-chip cellular RF front-end.
The chip’s single-die CMOS architecture supports the cellular industry’s entire 2G/3G/4G LTE frequency bands without sacrificing efficiency or linearity, claims the company.
Morfis plans to showcase at CES, 2016 its latest breakthroughs and demonstrate its game-changing, fully-integrated CMOS MMMB PAs and RF front-ends.
Morfis is sampling alpha customers and mass production is scheduled to start in 2016.