New Quick Charge IC For Smartphone Applications


To enable the next generation of fast charging, Power Integration has launched industry’s first charger interface IC compatible with Qualcomm’s Quick Charge (QC) 3.0 Technology, as claimed by the company. QC 3.0 is engineered to refuel devices up to four times faster than conventional charging. It is designed to charge twice as fast as Quick Charge 1.0 and to be 38 per cent more efficient than Quick Charge 2.0. The newly launched IC can prevent a mobile handset from overheating during high-speed charging and enhances the efficiency of the charging process.

Referring to the press release, CHY103D includes a wealth of protection features including Adaptive Output Overvoltage Protection (AOVP), which prevents the output from exceeding 120 per cent of the set output voltage, Output Soft Short-circuit Protection (OSSP), which detects partial shorts and stops power delivery to prevent overheating of cable and connector, and a Remote Shutdown Protection (RESP) feature which enables the powered device to shut the adapter off remotely if a fault is detected.

The IC enables voltage changes in 200 mV increments instead of the larger steps (e.g., from 5 volts to 9 or 12 volts) which helps in reducing heat dissipation and improving overall charging efficiency, as stated in the release. The release also mentions that the CHY103D device consumes less than 1 mW at 5 \V output; in combination with highly-efficient InnoSwitch devices, this low power consumption aids designers in complying with stringent efficiency requirements for chargers, such as the upcoming revision to the U.S. federal standards for external power supplies.

The newly launched IC is suitable for battery chargers for mobile devices such as tablets, smartphones, Bluetooth accessories and various USB power output ports.

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Click here to read the news release.


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