New P-ch MOSFET For Load Switches USB Type-C

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Toshiba launched a new P-ch MOSFET product for load switches of USB Type C terminals that conform to the USB Power Delivery (PD) standards. These products are suitable for applications such as charging circuits in smartphones, tablets and other mobile devices. USB has evolved from a data interface capable of supplying limited power to a primary provider of power with a data interface. Many devices nowadays charge or get their power from USB ports contained in laptops, cars, aircraft or even wall sockets. Users need USB to fulfil their requirements not only in terms of data but also to provide power to, or charge their devices simply, often without the need to load a driver, in order to carry out ‘traditional’ USB functions. The USB Power Delivery Specification enables the maximum functionality of USB by providing more flexible power delivery along with data over a single cable. Its aim is to operate with and build on the existing USB ecosystem. Further, referring Type C USB allows for bi-directional power. Thus, apart from charging the peripheral device, when applicable, a peripheral device could also charge a host device. This further implies that a user can do away with an array of proprietary power adapters and USB cables, and move to a single robust and tiny solution that works for all devices.

According to the media release, “Toshiba SSM6J507NU, a P-ch MOSFET product suitable for the load switches of USB Type-C terminals USB PD is a technology that allows a power supply of up to 100 W (20 V/5 A), while a load switch between a USB Type-C terminal and battery charger IC is required to have an isolation voltage of 20V or higher. SSM6J507NU is suitable for this application as it achieves VDSS=-30V and a low ON-resistance (RDS(ON)=19 mΩ typ.). In addition, Toshiba has launched SSM6J511NU and SSM6J512NU as well, each of which supports low voltage drive as a load switch between the battery and battery charger IC. All the three products use the small UDFN6B (2.0mm x 2.0 mm) package, which achieves excellent heat dissipation, helping reduce the footprint.”

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