The new Solid State Drives (SSD) equivalent to that of gum stick has the potential to create fundamental market shift in storage solution. The SSD is based on 3D NAND technology using stacks of layers of data storage cells vertically compared to that of NAND technology thus offering space to create storage devices with three times higher capacity.
According to the press release, the new 3D NAND technology mutually developed by Micron and Intel is the world’s highest density flash memory, as claims the company’s. The release further adds, “Based on the floating gate cell technique, the innovative 3D NAND technology stacks flash cells vertically in 32 layers to achieve 256Gb multilevel cell (MLC) and 384Gb triple-level cell (TLC) die that fit within a standard package. These capacities can enable gum stick-sized SSDs with more than 3.5TB of storage and standard 2.5-inch (6.35cm) SSDs, greater than 10TB. Since the capacity is achieved by stacking cells vertically, the individual cell dimensions can be considerably larger. This is expected to increase more storage in a smaller space, bringing significant cost savings, low-power usage and enable high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments”
Key features of 3D NAND Technology:
- Large Capacities -Three times the capacity of existing 3D technology-up to 48GB of NAND per die-enabling three-fourths of a terabyte to fit in a single fingertip-sized package.
- Reduced Cost per GB – First-generation 3D NAND architecture achieves better cost efficiency than planar NAND.
- Fast – High read/write bandwidth, I/O speeds and random read performance.
- Green – New sleep modes enable low-power use by cutting power to inactive NAND die (even when other die in the same package are active), dropping power consumption significantly in standby mode.
- Smart – Innovative new features improve latency and increase endurance over previous generations, and also make system integration easier.