TI has unveiled its latest DLP technology including chipset and evaluation modules (EVMs) to enable automakers develop next-generation augmented reality head-up displays (HUDs) with crisp, high-quality imagery.
The new DLP technology gives automakers and Tier-1 suppliers the ability to bring bright, dynamic augmented reality (AR) displays to windshields and place critical information within the driver’s line of sight.
Ti claims that the new DLP3030-Q1 chipset can be used to develop AR HUD systems that project virtual image distances (VIDs) of 7.5 meters and greater. The combination of increased VIDs and ability to showcase imagery across a wide field of view (FOV) gives designers the flexibility to create AR HUD systems with enhanced picture depth for an interactive, not distractive infotainment and cluster system.
Operating temperature is specified between -40 and 105 degrees Celsius.
The chipset delivers 15,000 cd/m2 brightness with the full-color gamut (125 percent National Television System Committee [NTSC]), enabling clear image visibility regardless of temperature or polarization, according to TI.
In addition, the chipset works with any light source including LEDs as well as laser-based projections.
To speed development, TI offers three new EVMs featuring the DLP3030-Q1 chipset.
The DLP3030-Q1 chipset, offered in a 32-mm by 22-mm CPGA package, is now available for sampling upon request. The EVMs are available for purchase on TI.com.
Technical documentation is also available upon request.
Learn more about the DLP3030-Q1 chipset
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