Infineon announced it is entering the packaged silicon microphone market with new low noise MEMS microphones having a 70 dB signal-to-noise ratio. Offered in a 4 mm x 3 mm x 1.2 mm MEMS package, the microphones are very well suited for high-quality acoustic recordings and far field voice capturing applications.
The SNR of 70 dB is an improvement of 6 dB compared to a conventional MEMS microphone. This improvement is equivalent to doubling the distance from which a user can give a voice command that is captured by the microphone.
The analog and digital microphones are built around Infineon’s dual backplate MEMS technology. In addition to a 70 dB SNR, they feature an exceptionally low distortion level of 10 percent at a 135 dB sound pressure level (SPL).
Infineon stated that current MEMS microphone technology uses a sound wave actuated membrane and a static backplate. In contrast, Infineon’s dual backplate MEMS technology uses a membrane embedded within two backplates thus generating a truly differential signal. “This allows improved high frequency immunity for better audio signal processing and increases the acoustic overload point of 10 percent Total Harmonic Distortion (THD) to 135 dB SPL”.
Additionally, the analog and digital microphones have excellent microphone-to-microphone matching (±1 dB sensitivity matching and ± 2° phase matching) which is ideal for implementing in arrays. This makes them a perfect fit for ultra-precise beam forming and noise cancelling.
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