Lattice Semiconductor is fostering the development of a variety of embedded vision applications in the industrial, automotive and consumer markets with a new embedded vision development kit. The kit, according to the firm, is optimized for mobile applications that require flexible, low cost, and low power image processing including robotics, drones, ADAS, smart surveillance cameras and AR/VR systems.
The innovative solution accelerates development of intelligent, vision-enabled devices at the edge. It leverages the CrossLink pASSP mobile bridging device, ECP5 low power, small form factor FPGA, along with its high-bandwidth, high resolution HDMI ASSP.
According to analyst firm IDC, “edge intelligence, which pushes processing for data intensive and processing applications away from the core to the edge of the network, is continuing to expand, to enable and realize the true value of IoT”. The firm further stated that intelligent systems revenue is forecast to exceed $2.2 trillion in 2020.
“As intelligence at the edge continues to increase, more applications will require integrated embedded vision technology”, said Deepak Boppana, director, product marketing at Lattice Semiconductor.
The CrossLink input board includes dual-camera HD image sensors supporting the MIPI CSI-2 interface, eliminating the need for external video sources.
The ECP5 base board enables low-power pre/post processing and includes support for HD image signal processing (ISP) intellectual property (IP) from Helion Vision. Also included is a NanoVesta connector to support external image sensor video inputs.
The HDMI output board based on the Sil1136 non-HDCP version enables connectivity to standard HDMI displays.
The Embedded Vision Development Kit is available now from Lattice and its distributors. To learn more, visit www.latticesemi.com/evdkit.
For further information, view the full Press release.