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SiP Binds MCU And Sub-GHz Radio For Wireless IoT Designs

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SiP Binds MCU And Sub-GHz Radio For Wireless IoT Designs

As the IoT demands more connectivity in everyday applications like connected home, smart city and industrial devices, Microchip has made a stride forward to support such applications with a new System in Package (SiP) which includes a single-chip RF microcontroller (MCU) and a 802.15.4 sub-GHz radio in a compact 5 mm package. The benefits of the new SAM R30 SiP include a compact footprint and the ability to offer multi-year battery life in these applications.

The SAM R30 SiP offers an excellent migration path from a discrete MCU and radio to a single-chip solution for more compact, cost-effective designs.

The SAM L21 MCU inside the SAM R30 SiP leverages the energy-efficient Cortex M0+ architecture.

Designed for battery-powered wirelessly connected systems, the low-power SAM R30 ensures battery life of multiple years. The device features ultra-low power sleep modes in which it is said to consume a mere 500 nA. It can be woken up from serial communication or General-Purpose Input/Output (GPIO).

With the ability to operate within the 769-935 MHz range, the SAM R30 SiP gives developers the flexibility to implement a point-to-point, star or mesh network.

The firm offers developers a free MiWi point-to-point/star network protocol stack to get started immediately. Microchip plans to make the mesh networking capabilities available later this year.

Nodes outfitted with the SiP can be positioned as far as one kilometer apart, with the ability to double the range in a star topology, says Microchip.

The firm foresees the applications of the new device when used in a mesh network as offering reliable wide-area coverage for applications such as street lighting or wind and solar farms.

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Developers can begin prototyping immediately with the ATSAMR30-XPRO development board, a convenient USB-interfaced development board that is supported by Atmel Studio 7 Software Development Kit (SDK).

The SAM R30 SiP is available in two QFN packages to be sampled or purchased in volume production quantities.

For more information about the SAM R30 SiP, visit: www.microchip.com/SAMR3
Click here to see the full Press release.

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