Supporting the new Bluetooth 5 specification for applications spanning industrial, consumer and automotive, TI has added two new wireless MCUs to its scalable SimpleLink Bluetooth low energy (BLE) family.
Based on ARM Cortex-M3, the devices claim more available memory, Bluetooth 5-ready hardware, automotive qualification and a new ultra-small wafer-chip-scale package (WCSP) option.
The new CC2640R2F wireless MCU has more available memory for more responsiveness and higher performance in IoT applications. A tiny 2.7×2.7 mm chip-scale package (WCSP), although quite smaller than TI’s smallest 4×4 mm QFN, is said to still deliver the longest range with the lowest power consumption.
The new CC2640R2F is ready for the Bluetooth 5 core specification which offers longer range, higher speed and more data for applications in building automation, medical, commercial and industrial automation.
The second device launched is the SimpleLink CC2640R2F-Q1 wireless MCU that enables smartphone connectivity for car access including passive entry passive start (PEPS) and remote keyless entry (RKE), as well as emerging automotive use cases with AEC-Q100 qualification and Grade 2 temperature rating.
The CC2640R2F-Q1 device, TI says, is the industry’s first chip to be offered in a wettable flank QFN package which helps reduce production line cost and increases reliability enabled by optical inspection of solder points.
To enable reuse, the devices are pin- and code-compatible with CC264x wireless MCUs. The CC264x family is supported by a unified software and application development environment, royalty-free BLE-Stack software, Code Composer Studio integrated development environment (IDE), system software and interactive training materials.
For car access and emerging applications such as assisted parking, car sharing and in-car cable replacement, the new AEC-Q100-qualified CC2640R2F-Q1 wireless MCU will support Bluetooth 5 in the second half of 2017.
TI offers development kits for CC2640R2F and CC2640R2F-Q1 wireless MCUs. The CC2640R2F wireless MCU LaunchPad development kit is available for US$29.
The CC2640R2F wireless MCU is offered in a 2.7×2.7 mm WCSP and 4×4, 5×5 and 7x7mm QFN packages starting at $2.00 in 1,000 unit volumes. Pre-release samples will be available in mid-February.
The CC2640R2F-Q1 wireless MCU is available in a 7×7 mm QFN package starting at $6.99 in 1,000 unit volumes.
For further information, view the full Press release.