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New FPGAs Make Best Fit For Automotive Apps

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New FPGAs Make Best Fit For Automotive Apps

Microsemi announced that its IGLOO2 field programmable gate arrays (FPGAs) meet automotive reliability levels by achieving AEC-Q100 grade 1. The company says the devices are most suitable alternate to ASICs providing a low-power, cost-effective, secure and reliable solution for applications including advanced driver assistance systems (ADAS), vehicle-to-vehicle/vehicle-to-everything (V2V/V2X) communication and electric/hybrid engine control units.

The automotive specification validates the devices as offering the highest junction temperature in its class, up to an impressive 125 degrees ambient (135 degrees Celsius junction). The devices also offer single event upset (SEU) immunity from neutron-induced firm errors, helping them achieve the zero defect rate essential for the automotive industry.

Bruce Weyer, vice president and business unit manager at Microsemi, explained: “Our automotive-grade FPGAs offer the highest reliability and security in critical under-the-hood applications to ensure the safety of our customers’ design, data and hardware. In addition to providing the highest operating temperature, the IGLOO2 FPGAs also provide the lowest total power in their class, enabling automotive designers to maximise their dynamic power budget in compact and high performance systems to deliver highly differentiated automotive solutions at the lowest total cost of ownership.”

The IGLOO2 devices are believed to address several challenges such as hacking, malicious tampering and data theft faced by system designers in creating safe and secure systems for the connected automobiles of the future, according to the company.

The devices will be available in March 2016 for mass production.

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